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As electronics and electrical systems improve, control and removal of waste heat become increasingly important. Our very low-density material channels heat at high diffusivity in one direction, while impeding heat transfer back to the delicate electronics.

Highly controlled microstructure provides reliable product performance
Unilateral thermal conductivity funnels heat from sensitive electronics
Radiofrequency shielding reduces outside interference from readings
Chemically inert material properties keep material from reacting to most acids or organic solvents

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Applications

Sensitive electronics
Aerospace
Medical
Ultrasound transducers

Specifications

Density	0.9 g/cc
Compressive strength	855 psi
Thermal conductivity
In Plane	245 W/m·K
Out of Plane	70 W/m·K
Total porosity	61%
Open porosity	95%
Average pore diameter	400 μ
Coefficient of thermal expansion
Temperature Range	In Plane ppm/°K (°C)	Out of Plane ppm/°K (°C)
323 to 423K (50° to 150°C)	1.02	-1.07
423 to 573K (150° to 300°C)	1.91	-0.02
573 to 873K (300° to 600°C)	2.64	0.73
873 to 1073K (600° to 800°C)	3.26	1.31