Our highly engineered materials rapidly channel heat away from sensitive areas, extending electronics and electromechanical systems lifetimes.
As electronics and electromechanical systems continually improve in efficiency, the localized heat generated in those systems grows exponentially.
We offer a family of thermal management materials including our HTC (High Thermal Conductivity) and POCOFoam®. These highly engineered materials rapidly channel heat unidirectionally away from sensitive areas, extending the lifetime and enhancing performance of these systems. Heat sinks using both aerodynamic and enthalpic heat transfer are possible, with a range of density potential that allows designers to maximize the trade between heat removal speed and system capacity.